PCB Thermal Via Calculator

Design thermal vias for heat dissipation. Calculate thermal resistance and number of vias needed.

Power Dissipation (W)

Via Drill (mm)

Plating Thickness (μm)

Board Thickness (mm)

Max T_j Rise (°C)

Cu Thermal Cond. (W/m·K)

R_{th_via} = L/(k×A)

N_vias = P×R_th/ΔT × 1.5 (safety)